4/27/2024 0 Comments Solder profile reflowPlease refer to product section for more information. Note: Not all of C&K products have been tested to this profile. Thermal profile done 2 times on each part listed.Maximum time above 183☌ for 60 seconds.Reflow at a maximum of 245☌ for 10 seconds.Pre-heat to a maximum of 200☌ for 30 seconds.Thermal profile in accordance with CEI 6 / EN 6.Thermal profile done 2 times on each part tested.SMT Reflow Soldering Profile of Reference Do not immerse or spray the unsealed areas of the switches with cleaners during flux removal. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Solder time is approximately 3 seconds maximum. Pb Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020E) Specifications are subject to change without notice. Hand soldering and cleaning are acceptable with properly trained personnel, small diameter solder (.030-.040 in.) and low wattage soldering irons (25-40 watts max.). Care during soldering and cleaning can prevent most process contamination problems encountered.Ĭontamination can occur in both hand soldering and machine soldering processes. Switches may become intermittent, especially in low power applications, and may become open during factory testing or later in the field. If using a reflow oven recipe generator check that it also considers the convection rate.Most manufacturing and field problems experienced by users of unsealed switches are caused by contamination of the internal switch contacts during soldering and cleaning processes. Many reflow ovens employ automated recipe generator software tools to facilitate the development of oven recipes. The pressure is adjusted by the control of the fan speed in each heated plenum. Convection rates are adjusted by setting the pressure in the heated air plenum in each zone. In a convection solder reflow oven convection is the dominant component of heat transfer. Modern reflow ovens used for mass production also have the ability to control convection rate – the speed at which the hot gases hit the product. Solder reflow ovens control the temperature profile by adjustments to the zone temperature set points and the belt speed. Controlling the Solder Reflow Oven Temperature Profile IPC/JEDEC J-STD-020, which defines soldering conditions for. The reflow oven profile will be compared to solder specifications and board/component limitations including: ramp rates, peak temperature, TAL (time above liquidus) and other factors. Surface Mount Packages are qualified by simulating the solder reflow conditions specified in. time data can also be downloaded as a table and can be manipulated by MS Excel or other statistical programs. The measured reflow oven profile is often displayed visually, as a graph, but the raw temperature vs. The profiles can be measured in a loaded or unloaded state by either processing boards ahead of and behind the thermocoupled board to simulate the load or by sending the thermocouple board through alone for an unloaded test. The attached thermocouples can be measured by trailing the wires through the oven while processing or using a recording device that can be passed through the reflow oven by use of an insulating cover. Placing multiple thermocouples in differing locations and on different types of components on the board will give you the most comprehensive understanding of the thermal profile. Best practices for attaching thermocouples also suggest using strain relief to prevent the TC’s from being pulled off the board when the wires are tugged. Aluminum or Kapton tape can be used to attach thermocouples, but is not suggested due to trapped air and loosening of the tape’s adhesive. In the double-sided PCB soldering process, components are placed and soldered on each side of the board individually. These thermocouples are attached using solder or epoxy. Reflow soldering will be used on high volume runs/low-cost prototyping runs, so designers should plan for reflow soldering during assembly. How to Profile a Solder Reflow OvenĪ solder reflow oven is profiled by attaching thermocouples (TC’s) to the board that is being processed. The difference between the reflow oven set points, or recipe, and the thermal profile is governed by the laws of heat transfer and is affected by mass (weight of the product), surface area, thickness, and the heat capacity (the ability of a material to absorb or give up heat). The temperature settings combined with the belt speed, and the convection rate settings, will produce the thermal profile on the board or product. The recipe is the temperature settings of the reflow oven in each zone. A thermal profile is a measurement of the temperature, of the product, during thermal processing. The most common SMT reflow method, and the method. The thermal profile is an critical consideration in the solder reflow process. The device should be allowed to self-center itself during the reflow profile.
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